High-fill, fast-flow materials balance reliability and throughput, extend company’s underfill leadership to package level with multi-format solutions
Seoul, South Korea, September 14, 2022 /PRNewswire/ — Henkel today announced the release of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications. The material, Loctite EccobondUF 9000AG, enables advanced silicon (Si) node flip-chip integration by providing robust interconnect protection and compatibility with high-volume manufacturing environments. While the company has well-established pre-applied paste and film underfill materials for advanced chip technologies, this development expands Henkel’s post-applied capillary portfolio for flip chips with advanced node scaling.
Loctite Eccobond UF 9000AG exceeds conventional formulation paradigms, balancing high load bearing and fast flow capability to meet the extreme reliability and bulk demands of next-generation semiconductor device packaging. Already proven in mass production environments with the last node and currently being evaluated for The next generation node flip chip, the product is an epoxy-based underfill designed with a high glass transition temperature (Tg) and an ultra-low coefficient of thermal expansion (CTE) ( 70%) of the market to allow for excellent impact protection, it still fills 30% faster, as tested against previous generation and competitor CUFs. Additionally, Loctite Eccobond UF 9000AG offers high fracture toughness, low warpage and MSL3 reliability on dies ranging in size from 10mm x 10mm to 20mm x 20mm.
“This innovative solution represents a major breakthrough for the future of advanced flip-chip device processing and end-product performance,” said Ramachandran Trichur, head of Henkel’s global market segment for semiconductor packaging materials, explaining the importance of the material’s unique balance of filler, resin and hardener. “Historically, high load loading has been correlated with slower underfill rates. Loctite Eccobond UF 9000AG goes beyond this limit. It gives integrators the last knot – and eventually The next generation – node chips a more comprehensive low CTE, high throughput solution that combines productivity with complete solder joint protection.”
The increasing use of the last knot flip chips and the forecast that next-generation node scaling devices will be in volume production by the end of the year underscores the immediate need for a proven chip protection solution and improved reliability. reliability. Loctite Eccobond UF 9000AG meets the demanding performance criteria of advanced mobile devices and, having successfully passed the most severe Level C thermal cycle tests (-65°C to 150°C)may also be a good candidate for certain automotive electronics and computer applications.
“With the addition of a best-in-class CUF, Henkel now stands out among semiconductor materials suppliers for engineering underfill formulations in all formats to meet the most advanced chip designs,” said Trichur said. “Henkel’s non-conductive paste (NCP) and non-conductive film (NCF) pre-applied underfills are currently used in high-volume advanced packaging manufacturing. Regardless of process preference or device requirement, Henkel offers innovation versatility for the most sophisticated semiconductor technologies.”
For more information, visit www.henkel-adhesives.com/electronics.
Henkel operates globally with a well-balanced and diversified portfolio. The company holds leading positions with its three business units in the industrial and consumer sectors through strong brands, innovations and technologies. Henkel Adhesive Technologies is the global market leader in adhesives, across all industry segments worldwide. In its Laundry & Home Care and Beauty Care businesses, Henkel holds leading positions in many markets and categories around the world. Founded in 1876, Henkel looks back on more than 140 years of success. In 2021, Henkel achieved sales of more than 20 billion euros and adjusted operating income of around €2.7 billion. Henkel employs approximately 53,000 people worldwide – a passionate and highly diverse team united by a strong corporate culture, a common goal of creating sustainable value and shared values. As a recognized leader in sustainability, Henkel ranks first in many international indices and rankings. Henkel’s preferred shares are listed in the German DAX stock index. For more information, please visit www.henkel.com.
SOURCE Henkel Electronic Adhesive